News
[News] SK hynix CEO Reportedly to Meet Bill Gates, Deepening AI Memory Ties Amid Microsoft ASIC Push
3+ hour, 16+ min ago (384+ words) Trend Force Trend Force News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] SK hynix CEO Reportedly to Meet Bill Gates, Deepening AI Memory Ties Amid Microsoft ASIC Push Microsoft…...
[News] Samsung Reportedly Plans Galaxy S26 Tactical Military Phone Later This Year; Apple Also Eyes Entry
1+ day, 20+ hour ago (385+ words) Trend Force Trend Force News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Samsung Reportedly Plans Galaxy S26 Tactical Military Phone Later This Year; Apple Also Eyes Entry Samsung Electronics is…...
[News] Huawei's Chip Fundamental Technology Research Lab Featured on CCTV News Broadcast
2+ day, 2+ hour ago (22+ words) Recently, Huawei's Chip Fundamental Technology Research Laboratory made its public debut on China Central Television's flagship news program Xinwen Li. .....
[News] SK hynix Reportedly Tests Intel EMIB 2. 5 D Packaging With HBM Amid TSMC Co Wo S Tightness
2+ day, 17+ hour ago (120+ words) SK hynix is reportedly exploring cooperation with Intel in advanced 2. 5 D packaging, a move that could signal potential shifts in the AI chip packaging. .....
[Sponsored Content] From Single-Task to Multi-Functional: Advantech Empowers ADATA in Developing Multi-Robot Collaborative AI AMRs
2+ day, 2+ hour ago (112+ words) In recent years, ADATA Technology, which started in memory and storage, has undergone a magnificent transformation from "data storage" to "physical co. .....
[News] China Memory Module Maker POWEV Advances DDR5 Push as 64 GB RDIMM Reportedly Enters Volume Production
2+ day, 2+ hour ago (384+ words) Trend Force Trend Force News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] China Memory Module Maker POWEV Advances DDR5 Push as 64 GB RDIMM Reportedly Enters Volume Production As the market…...
[News] Intel 18 A-P and TSMC A16 Set for VLSI Showdown in Advanced Node Push: 18% Power Savings vs SPR Debut
1+ week, 7+ hour ago (477+ words) Trend Force Trend Force News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Intel 18 A-P and TSMC A16 Set for VLSI Showdown in Advanced Node Push: 18% Power Savings vs SPR Debut…...
[News] Chinese Researchers Advance Wafer-Scale Integration of Single-Crystal 2 D Semiconductors
1+ week, 9+ hour ago (293+ words) Mo S" consists of a single layer of molybdenum atoms sandwiched between two layers of sulfur atoms, with a thickness of only about 0. 6 nanometers'effectively at the atomic scale. This extreme thinness endows the material with exceptional mechanical flexibility, allowing it…...
[News] JEDEC Nears 2nd-Gen MRDIMM as CPUs Demand More Bandwidth; Samsung, SK hynix Reportedly Accelerate Push
1+ week, 1+ day ago (335+ words) According to ZDNet, HBM is integrated with graphics processing units (GPUs) to handle AI computation workloads, while MRDIMM serves as main memory directly accessed by the CPU. ZDNet highlights that the module, designed to be optimized for AI data centers,…...
[News] TSMC Reportedly Upgrades Central Taiwan 28/22nm Fab to 4nm; Phase 2 1. 4nm Trial Production May Start 3 Q27
1+ week, 1+ day ago (414+ words) Trend Force Trend Force News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] TSMC Reportedly Upgrades Central Taiwan 28/22nm Fab to 4nm; Phase 2 1. 4nm Trial Production May Start 3 Q27 TSMC is reportedly upgrading its…...