2+ hour, 24+ min ago  (369+ words) Researchers from Binghamton University used commercial parchment paper, commonly used in baking, along with a standard carbon dioxide laser and water-based conductive ink to create disposable, single-use electronic circuits. The laser selectively removes the paper's thin silicone coating in specific…...

1+ day, 2+ hour ago  (1631+ words) The gap between lab performance and fab reality is growing wider as packages grow more complex. It's generally assumed advanced materials will behave the same in the lab as in production, but that assumption is now under serious pressure. But…...

3+ day, 14+ hour ago  (74+ words) Semiconductor Engineering Chip Industry Week In Review Startup Funding: Q1 2026 IC Security Threats Spike With Quantum, AI, And Automotive Memory Wall Gets Higher All AI Data Center Interconnects Will Be Optical Within 5 Years Panel-Level Packaging's Second Wave Meets Engineering Reality AI's…...

4+ day, 2+ hour ago  (642+ words) Marvell's plasmonics buy; Onto's process control stake; TSMC A14/13 and EDA flows; Apple shuffle; LPDDR6; SOCAMM2 chipset; MATCH Act progress; EV resist crunch; India 3 D packaging fab; digital test card for HPC; telemetry platform for power management; edge AI MCU for voice; new…...

5+ day, 2+ hour ago  (149+ words) Engineering considerations in multi-chiplet designs. The post System-in-Package Challenges appeared first on Semiconductor Engineering. Systems companies and leading-edge chipmakers are pushing past reticle limits with chiplet-based designs, often breaking compute-intensive functions into different chiplets and coupling those with other chiplets…...

5+ day, 2+ hour ago  (1863+ words) As models evolve faster than silicon cycles, experts weigh how much adaptability architects can afford without sacrificing power, area, or efficiency. The post Can Edge AI Keep Up? appeared first on Semiconductor Engineering. Can Edge AI Keep Up? As models…...

1+ mon, 3+ week ago  (340+ words) The rise of localized computing facilities positioned physically close to where data is generated. The modern world no longer runs on delayed responses. It runs on immediacy. Data centers'have long been the backbone of the global digital economy, supporting cloud…...

6+ day, 2+ hour ago  (332+ words) Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs. In a podcast, Siemens EDA's Harry Foster and Vladislav Palfy chat about why coverage closure has become one of the biggest bottlenecks in modern verification and how a…...

6+ day, 2+ hour ago  (933+ words) Creating through-silicon vias is a necessary but daunting challenge. Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon interposers, and emerging 3 D chip stacks, but as TSV dimensions shrink they are becoming increasingly expensive to…...

1+ week, 2+ hour ago  (174+ words) Researchers from the University of Michigan mapped complex state space models directly onto a compute-in-memory architecture in an example of hardware-software co-design for edge AI. The state space model was implemented on a resistive RAM crossbar array fabricated using a…...